Display device

ABSTRACT

Display device is provided and includes scanning line; semiconductor layer; pixel electrode; first insulating film having first contact hole; organic insulating film having second contact hole; and second insulating film having third contact hole, wherein semiconductor layer has first linear portion that is orthogonal to scanning line, pixel electrode is electrically connected to first linear portion via first, second and third contact holes, first linear portion overlaps first, second and third contact holes that are aligned along first linear portion, and center of second contact hole is located between center of first contact hole and center of third contact hole.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.17/142,839, filed on Jan. 6, 2021, which application is a continuationof PCT International Patent Application No. PCT/2019/025729 filed onJun. 27, 2019 which designates the United States, incorporated herein byreference, and which claims the benefit of priority from Japanese PatentApplication No. 2018-130222 filed on Jul. 9, 2018, incorporated hereinby reference.

BACKGROUND 1. Technical Field

The present disclosure relates to a display device.

2. Description of the Related Art

Japanese Patent Application Laid-open Publication No. 2017-146449(JP-A-2017-146449) describes a display device that suppresses displayunevenness caused by an orientation film around a contact hole.

In the technique of (JP-A-2017-146449), although display unevennesscaused by the orientation film around the contact hole is suppressed tosome extent, it is desired to further suppress the occurrence of displayunevenness.

The present disclosure aims to provide a display device that suppressesdisplay unevenness caused by an orientation film around a contact hole.

A display device according to one aspect comprising: an array substrate;a counter substrate provided with color filters; and a liquid crystallayer between the array substrate and the counter substrate; wherein onesurface of the array substrate includes a plurality of signal linesarranged side by side in a first direction with a gap interposedtherebetween, a plurality of scanning lines arranged side by side in asecond direction with a gap interposed therebetween, a first organicinsulating film provided on the signal lines, and a second organicinsulating film provided on the first organic insulating film; eachregion surrounded by the corresponding scanning line and thecorresponding signal line includes a semiconductor layer, a firstcontact conductive layer, a second contact conductive layer, and a firstelectrode; the signal line is electrically coupled to a first part ofthe semiconductor layer, and the first contact conductive layer iselectrically coupled to a second part of the semiconductor layer; thesecond contact conductive layer comes into contact with the firstcontact conductive layer via a first contact hole formed in the firstorganic insulating film; at least a part of a contact region of thesecond contact conductive layer in which the second contact conductivelayer is in contact with the first contact conductive layer is coveredwith the second organic insulating film; the first electrode and thesecond contact conductive layer are electrically coupled to each othervia a second contact hole formed in the second organic insulating film;and the first contact hole and the second contact hole deviate from eachother in the second direction.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view of a display device according toa first embodiment;

FIG. 2 is a plan view schematically illustrating an array substrate;

FIG. 3 is a circuit diagram of a pixel array in a display regionaccording to the first embodiment;

FIG. 4 is a plan view for explaining detection electrodes in a schematicplan view of pixels;

FIG. 5 is a plan view for explaining pixel electrodes in the schematicplan view of the pixels;

FIG. 6 is a partial sectional view for explaining the VI-VI′ section inFIG. 4 ;

FIG. 7 is a plan view for explaining switching elements according to thefirst embodiment;

FIG. 8 is a plan view for explaining contact holes according to thefirst embodiment;

FIG. 9 is a partial sectional view for explaining the IX-IX′ section inFIG. 8 ;

FIG. 10 is a sectional view for explaining widened parts of metal wires;

FIG. 11 is a sectional view for explaining widened parts of sensorwires;

FIG. 12 is a sectional view for explaining widened parts of metal wires;

FIG. 13 is a plan view for explaining widened parts of metal wires;

FIG. 14 is a plan view for explaining contact holes according to asecond embodiment;

FIG. 15 is a partial sectional view for explaining the XV-XV′ section inFIG. 14 ;

FIG. 16 is a plan view for explaining the switching elements accordingto a third embodiment; and

FIG. 17 is a schematic diagram for explaining sub-pixels according tothe third embodiment.

DETAILED DESCRIPTION

Exemplary aspects (embodiments) to embody the present disclosure aredescribed below in greater detail with reference to the accompanyingdrawings. The contents described in the embodiments are not intended tolimit the present disclosure. Components described below includecomponents easily conceivable by those skilled in the art and componentssubstantially identical therewith. The components described below may beappropriately combined. What is disclosed herein is given by way ofexample only, and appropriate modifications made without departing fromthe spirit of the present disclosure and easily conceivable by thoseskilled in the art naturally fall within the scope of the disclosure. Tosimplify the explanation, the drawings may possibly illustrate thewidth, the thickness, the shape, and other elements of each unit moreschematically than the actual aspect. These elements, however, are givenby way of example only and are not intended to limit interpretation ofthe present disclosure. In the present disclosure and the figures,components similar to those previously described with reference toprevious figures are denoted by like reference numerals, and detailedexplanation thereof may be appropriately omitted.

First Embodiment

FIG. 1 is an exploded perspective view of a display device according toa first embodiment. As illustrated in FIG. 1 , a display device PNLincludes an array substrate SUB1 and a counter substrate SUB2. Asillustrated in FIG. 1 , the display device PNL has a peripheral regionBE outside a display region DA. While the display region DA has arectangular shape, the outer shape of the display region DA is notparticularly limited. The display region DA may have a cut-out or haveanother polygonal shape, for example. The display region DA may haveanother shape, such as a circular or elliptic shape.

A first direction X according to the present embodiment extends alongthe short side of the display region DA. A second direction Y intersects(or is orthogonal to) the first direction X. The first direction X andthe second direction Y are not limited thereto, and the second directionY may intersect the first direction X at an angle other than 90 degrees.The plane defined by the first direction X and the second direction Y isparallel to the surface of the array substrate SUB1. A third direction Zorthogonal to the first direction X and the second direction Y is thethickness direction of the array substrate SUB1.

The display region DA is a region for displaying images and overlaps aplurality of pixels Pix. The peripheral region BE is positioned on theinner side than the outer periphery of the array substrate SUB1 and onthe outer side than the display region DA. The peripheral region BE mayhave a frame shape surrounding the display region DA. In this case, theperipheral region BE may also be referred to as a frame region.

The display region DA that displays images includes a sensor regionincluded in a detection device that detects capacitance. As illustratedin FIG. 1 , a plurality of detection electrodes CE are arrayed in amatrix (row-column configuration) in the first direction X and thesecond direction Y in the display region DA. The detection electrodes CEeach have a rectangular or square shape schematically in planar view.The shape of the detection electrodes CE will be described later ingreater detail. The detection electrodes CE are made of a translucentconductive material, such as indium tin oxide (ITO).

As illustrated in FIG. 1 , the peripheral region BE on a first surfaceof the array substrate SUB1 is provided with outer edge wires CE-G andan integrated circuit CP. The outer edge wires CE-G, for example, areprovided continuously along the long sides and a short side of thedisplay region DA and surrounds the display region DA.

The display device PNL is a display device with a sensor and integratesthe sensor region with the display region DA. Specifically, in thedisplay device PNL, a part of the members in the display region DAserves as the detection electrodes CE in the sensor region.

FIG. 2 is a plan view schematically illustrating the array substrate. Asillustrated in FIG. 2 , the detection electrodes CE are divided into amatrix (row-column configuration) in the first direction X and thesecond direction Y by slits SPB. A coupling circuit MP and theintegrated circuit CP are provided on a short side of the peripheralregion BE. A flexible substrate, which is not illustrated, is coupled tothe short side of the peripheral region BE. The positions of thecoupling circuit MP and the integrated circuit CP are not limitedthereto, and they may be provided on a control substrate outside themodule or the flexible substrate, for example.

The detection electrodes CE are electrically coupled to the integratedcircuit CP via metal wires TL and the coupling circuit MP. The metalwires TL supply a drive signal to be supplied to the detectionelectrodes CE, and send a signal corresponding to a change incapacitance to an analog front end. The metal wires TL are electricallycoupled to the respective detection electrodes CE disposed in thedisplay region DA and extend to the peripheral region BE. The metalwires TL extend along the second direction Y and are disposed side byside in the first direction X. A drive circuit included in theintegrated circuit CP, for example, is coupled to the detectionelectrodes CE via the coupling circuit MP disposed in the peripheralregion BE and the metal wires TL.

Contact holes TH each have a coupling part CT (refer to FIGS. 10 to 12 )at which the detection electrode CE and the metal wire TL overlappingthe detection electrode CE are electrically coupled. In FIG. 2 , onemetal wire TL is schematically coupled to one detection electrode CE. Inan actual configuration, the metal wires TL each include a plurality ofwires and extend in the display region DA, which will be describedlater.

The display device PNL includes the coupling circuit MP. The couplingcircuit MP is provided between the detection electrodes CE and theintegrated circuit CP. The coupling circuit MP switches coupling anddecoupling the detection electrode CE to be a target of detection driveto and from the integrated circuit CP based on control signals suppliedfrom the integrated circuit CP. The coupling circuit MP includes analogfront ends.

FIG. 3 is a circuit diagram of a pixel array in the display regionaccording to the first embodiment. In the following description, aplurality of scanning lines G1, G2, and G3 may be collectively referredto as scanning lines GL. A plurality of signal lines S1, S2, and S3 maybe collectively referred to as signal lines SL. The array substrate SUB1is provided with switching elements TrD1, TrD2, and TrD3 of sub-pixelsSPix1, SPix2, and SPix3, the signal lines SL, the scanning lines GL, andother components illustrated in FIG. 3 . The signal lines S1, S2, and S3are wires that supply pixel signals to pixel electrodes PE1, PE2, andPE3 (refer to FIG. 4 ), respectively. The scanning lines G1, G2, and G3are wires that supply gate signals for driving the switching elementsTrD1, TrD2, and TrD3.

As illustrated in FIG. 3 , the pixels Pix in the display region DAillustrated in FIG. 1 each include the sub-pixels SPix1, SPix2, andSPix3 arrayed in a matrix (row-column configuration). In the followingdescription, the sub-pixels SPix1, SPix2, and SPix3 may be collectivelyreferred to as sub-pixels SPix. The sub-pixels SPix1, SPix2, and SPix3include the switching elements TrD1, TrD2, and TrD3, respectively, andcapacitance of a liquid crystal layer LC. The switching elements TrD1,TrD2, and TrD3 are thin-film transistors and are n-channel metal oxidesemiconductor (MOS) TFTs in this embodiment. A sixth insulating film 16(refer to FIG. 6 ) is provided between the pixel electrodes PE1, PE2,and PE3, which will be described later, and the detection electrode CE,thereby forming holding capacitance Cs illustrated in FIG. 3 .

Color filters CFR, CFG, and CFB illustrated in FIG. 3 are cyclicallyarrayed color regions in three colors of red (R), green (G), and blue(B), for example. The color regions in the three colors of R, G, and Bserve as a set and correspond to the respective sub-pixels SPix1, SPix2,and SPix3 illustrated in FIG. 3 . A set of the sub-pixels SPix1, SPix2,and SPix3 corresponding to the respective color regions in the threecolors serves as one pixel Pix. The color filters may include colorregions in four or more colors.

FIG. 4 is a plan view for explaining the detection electrodes in aschematic plan view of the pixels. FIG. 5 is a plan view for explainingthe pixel electrodes in the schematic plan view of the pixels. FIG. 6 isa partial sectional view for explaining the VI-VI′ section in FIG. 4 .FIG. 7 is a plan view for explaining the switching elements according tothe first embodiment. FIG. 8 is a plan view for explaining contact holesaccording to the first embodiment. FIG. 9 is a partial sectional viewfor explaining the IX-IX′ section in FIG. 8 . FIGS. 10 to 12 aresectional views for explaining widened parts of metal wires. FIG. 13 isa plan view for explaining widened parts of metal wires. FIG. 13 is adiagram for explaining the widened parts of the metal wires. Thefollowing describes the specific display device according to the firstembodiment with reference to FIGS. 1 to 13 .

As illustrated in FIG. 6 , the signal lines S1, S2, and S3, the pixelelectrodes PE1, PE2, and PE3, the detection electrodes CE, and aplurality of metal wires TL1, TL2, and TL3 are provided on a firstinsulating substrate 10. In the following description, the metal wiresTL1, TL2, and TL3 may be collectively referred to as a metal wire TL. Inthe following description, the pixel electrodes PE1, PE2, and PE3 may becollectively referred to as a pixel electrode PE. As illustrated in FIG.4 , the scanning lines G1 to G3 extend along the first direction X andare disposed side by side at regular pitches in the second direction Y.While the scanning lines G1 to G3 are not illustrated in FIG. 6 , theyare also provided on the first insulating substrate 10.

In FIGS. 4 and 5 , D1 is defined as a direction intersecting the seconddirection Y counter-clockwisely at an acute angle, and D2 is defined asa direction intersecting the second direction Y clockwisely at an acuteangle. An angle θ1 between the second direction Y and the direction D1is substantially equal to an angle θ2 between the second direction Y andthe direction D2. The signal lines S1 to S3 extend approximately alongthe second direction Y and are disposed side by side at regular pitchesin the first direction X. In the illustrated example, the signal linesS1 to S3 extend in the direction D1 between the scanning line G1 and thescanning line G2 and in the direction D2 between the scanning line G2and the scanning line G3. The scanning lines G1 to G3 and the signallines S1 to S3 intersect each other in a planar view of the X-Y plane.

As illustrated in FIG. 7 , the switching element TrD1 is positioned nearthe intersection of the scanning line G2 and the signal line S1 andelectrically coupled to the scanning line G2 and the signal line S1. Theswitching element TrD2 is positioned near the intersection of thescanning line G2 and the signal line S2 and electrically coupled to thescanning line G2 and the signal line S2. The switching element TrD3 ispositioned near the intersection of the scanning line G2 and the signalline S3 and electrically coupled to the scanning line G2 and the signalline S3.

As illustrated in FIG. 5 , the pixel electrodes PE1, PE2, and PE3 aredisposed side by side in the first direction X with gaps interposedtherebetween. The pixel electrode PE1 is positioned between two signallines SL. The pixel electrodes PE1, PE2, and PE3 are disposed side byside in the second direction Y with gaps interposed therebetween. Thepixel electrode PE1 is positioned between two scanning lines GL. Theplurality of pixel electrodes PE1, PE2, and PE3 are located in an areasurrounded by corresponding two signal lines SL and corresponding twoscanning lines GL.

The pixel electrode PE1 has a contact part PA1, electrode parts PB1, anda connecting part PC1. The contact part PA1 is electrically coupled tothe switching element TrD1 (refer to FIG. 7 ). The electrode part PB1extends from the contact part PA1 to the side closer to the scanningline G1, which is the opposite side to the scanning line G2. Theelectrode part PB1 may also be referred to as a strip electrode, alinear electrode, or a comb electrode, for example. In FIG. 5 , onepixel electrode PE1 includes two electrode parts PB1. The two electrodeparts PB1 are coupled to the contact part PA1. The electrode parts PB1are disposed side by side in the first direction X with a gap interposedtherebetween. The connecting part PC1 is coupled to the ends of the twoelectrode parts PB1. If part of a first electrode part PB1 is broken,this structure can supply a pixel potential to the first electrode partPB1 from a second electrode part PB1 via the connecting part PC1.

The shape of the pixel electrode PE1 is not limited to that in theexample illustrated in FIG. 5 . The pixel electrode PE1 does notnecessarily have the connecting part PC1, and the number of electrodeparts PB1 may be not two but three or four, for example.

The pixel electrode PE2 has substantially the same shape as that of thepixel electrode PE1. The pixel electrode PE2 is positioned between twosignal lines. The pixel electrode PE2 has a contact part PA2, electrodeparts PB2, and a connecting part PC2. The contact part PA2 iselectrically coupled to the switching element TrD2 (refer to FIG. 7 ).The electrode parts PB2 extend from the contact part PA2 toward thescanning line G1.

The pixel electrode PE3 has substantially the same shape as that of thepixel electrode PE1. The pixel electrode PE3 is positioned between twosignal lines. The pixel electrode PE3 has a contact part PA3, electrodeparts PB3, and a connecting part PC3. The contact part PA3 iselectrically coupled to the switching element TrD3 (refer to FIG. 7 ).The electrode parts PB3 extend from the contact part PA3 toward thescanning line G1.

All of the electrode parts PB1, PB2, and PB3 extend in the samedirection parallel to the direction D1. All of the electrode parts PB1,PB2, and PB3 extend from the respective contact parts toward thescanning line G1. While the pixel electrodes positioned between thescanning lines G2 and G3 have the same structure as that of the pixelelectrodes PE1 to PE3, their electrode parts extend along the directionD2.

As illustrated in FIG. 4 , the detection electrode CE includes a maindetection electrode CEP, a sub-detection electrode CEA, and asub-detection electrode CEB. The main detection electrodes CEP areprovided on substantially the whole display region DA (refer to FIG. 1 )of the array substrate SUB1. In other words, the sub-pixels include thepixel electrodes PE1, PE2, and PE3, and the main detection electrode CEP(detection electrode CE) is provided in a region overlapping the pixelelectrodes PE1, PE2, and PE3. In a planar view of the X-Y plane, themain detection electrode CEP overlaps the pixel electrodes PE1, PE2, andPE3, the signal lines S1, S2, and S3, and the metal wires TL1 and TL2but does not overlap the scanning lines G1, G2, and G3.

As illustrated in FIG. 4 , the sub-detection electrode CEA extends inthe second direction Y and electrically couples the main detectionelectrodes CEP disposed side by side in the second direction Y. In aplanar view of the X-Y plane, the sub-detection electrode CEA overlapsthe scanning lines G1, G2, and G3, the signal line S2, and the metalwire TL2 but does not overlap the pixel electrodes PE1, PE2, and PE3,the signal lines S1 and S3, or the metal wires TL1 and TL3. If nosub-detection electrode CEA is provided between the main detectionelectrodes CEP disposed side by side in the second direction Y, a slitSPB is formed.

As illustrated in FIG. 4 , the sub-detection electrode CEB extends inthe first direction X and electrically couples the main detectionelectrodes CEP disposed side by side in the first direction X. Asillustrated in FIG. 4 , if no sub-detection electrode CEB is providedbetween the main detection electrodes CEP disposed side by side in thefirst direction X, the slit SPB is formed. In a planar view of the X-Yplane, the sub-detection electrode CEB overlaps the signal line S3, themetal wire TL3, and a widened part TCE3 but does not overlap the pixelelectrodes PE1, PE2, and PE3, the scanning line G1, G2, and G3, thesignal lines S1 and S2, or the metal wires TL1 and TL2. Thesub-detection electrode CEB overlaps the widened part TCE3 and forms aslit SPA. The sub-detection electrode CEB thus can reduce the differencein visibility between the slit SPA and the slit SPB formed between thedetection electrodes CE disposed side by side in the first direction X,thereby reducing parasitic capacitance generated between the detectionelectrode CE and the metal wire TL.

As described above, the detection electrode CE includes the maindetection electrode CEP and the sub-detection electrodes CEA and CEB.The main detection electrode CEP has an island shape. The main detectionelectrodes CEP disposed side by side in the first direction X or thesecond direction Y are electrically coupled by the sub-detectionelectrode CEA or CEB. As a result, the detection electrode CE can have adesired area.

In a planar view of the X-Y plane, the metal wires TL1, TL2, and TL3overlap the signal lines S1, S2, and S3, respectively, and extend inparallel with these signal lines.

In FIG. 6 , the array substrate SUB1 includes the translucent firstinsulating substrate 10, such as a glass substrate and a resinsubstrate, serving as a base. The array substrate SUB1 includes a firstinsulating film 11, a second insulating film 12, a third insulating film13, a fourth insulating film 14, a fifth insulating film 15, the sixthinsulating film 16, the signal lines S1 to S3, the pixel electrodes PE1to PE3, the detection electrode CE, a first orientation film AL1, andother components on the first insulating substrate 10 on the side facingthe counter substrate SUB2. In the following description, a directionfrom the array substrate SUB1 to the counter substrate SUB2 is referredto as an upper side or simply referred to as up.

The first insulating film 11 is positioned on the first insulatingsubstrate 10. The second insulating film 12 is positioned on the firstinsulating film 11. The third insulating film 13 is positioned on thesecond insulating film 12. The signal lines S1 to S3 are positioned onthe third insulating film 13. The fourth insulating film 14 ispositioned on the third insulating film 13 and covers the signal linesS1 to S4.

The metal wires TL1, TL2, and TL3 are positioned on the fourthinsulating film 14. The metal wires TL1, TL2, and TL3 are made of ametal material including any one of Al, Mo, and W. The metal wires TL1,TL2, and TL3 have lower resistance than that of the detection electrodeCE and have conductivity. The metal wires TL1, TL2, and TL3 face thesignal lines S1, S2, and S3, respectively, with the fourth insulatingfilm 14 interposed therebetween. In other words, the metal wires TL1,TL2, and TL3 overlap the signal lines S1, S2, and S3, respectively. Themetal wires TL1, TL2, TL3 are covered with the fifth insulating film 15.The first insulating film 11, the second insulating film 12, the thirdinsulating film 13, and the sixth insulating film 16 are made of atranslucent inorganic material, such as a silicon oxide or a siliconnitride. The fourth insulating film 14 and the fifth insulating film 15are made of a translucent resin material such as acrylate resin and havea thickness larger than that of the other insulating films made of theinorganic material. The fourth insulating film 14 serves as a firstorganic insulating film, and the fifth insulating film 15 serves as asecond organic insulating film. For example, the fourth insulating film14 is 2 μm or more and 3 μm or less. The fifth insulating film 15 is 1μm or more and 2 μm or less. The fourth insulating film 14 is formedthicker than the fifth insulating film 15.

The detection electrode CE is positioned on the fifth insulating film15. In FIG. 6 , the detection electrode CE faces the metal wires TL1 andTL2 with the fifth insulating film 15 interposed therebetween. In FIG. 6, the slit SPA between the detection electrodes CE is positioned rightabove the metal wire TL3. The detection electrode CE is covered with thesixth insulating film 16. The sixth insulating film 16 is made of atranslucent inorganic material, such as a silicon oxide or a siliconnitride.

The pixel electrodes PE1 to PE3 are positioned on the sixth insulatingfilm 16 and face the detection electrode CE with the sixth insulatingfilm 16 interposed therebetween. The pixel electrodes PE1 to PE3 and thedetection electrode CE are made of a translucent conductive material,such as ITO and indium zinc oxide (IZO). The pixel electrodes PE1 to PE3are covered with the first orientation film AL1. The first orientationfilm AL1 also covers the sixth insulating film 16.

The counter substrate SUB2 includes a translucent second insulatingsubstrate 20, such as a glass substrate and a resin substrate, servingas a base. The counter substrate SUB2 includes a light-shielding layerBM, the color filters CFR, CFG, and CFB, an overcoat layer OC, a secondorientation film AL2, and other components on the second insulatingsubstrate 20 on the side facing the array substrate SUB1.

As illustrated in FIG. 6 , the light-shielding layer BM is positioned onthe second insulating substrate 20 on the side facing the arraysubstrate SUB1. As illustrated in FIG. 5 , the light-shielding layer BMdefines openings AP facing the pixel electrodes PE1 to PE3. Thelight-shielding layer BM is made of a black resin material or alight-shielding metal material.

The color filters CFR, CFG, and CFB are positioned on the secondinsulating substrate 20 on the side facing the array substrate SUB1.Ends of the color filters CFR, CFG, and CFB overlap the light-shieldinglayer BM. The color filter CFR faces the pixel electrode PE1. The colorfilter CFG faces the pixel electrode PE2. The color filter CFB faces thepixel electrode PE3. The color filters CFR, CFG, and CFB are made ofresin materials in red, green, and blue, respectively, for example.

The overcoat layer OC covers the color filters CFR, CFG, and CFB. Theovercoat layer OC is made of a translucent resin material. The secondorientation film AL2 covers the overcoat layer OC. The first orientationfilm AL1 and the second orientation film AL2 are made of a horizontallyoriented material, for example.

The light-shielding layer BM may be formed between any of the colorfilters CFR, CFG, and CFB and the overcoat layer OC, and thelight-shielding layer BM may be formed between the overcoat layer OC andthe second orientation film AL2.

As described above, the counter substrate SUB2 includes thelight-shielding layer BM, the color filters CFR, CFG, and CFB, and othercomponents. The light-shielding layer BM is disposed in a region facingthe wires, such as the scanning lines G1, G2, and G3, the signal linesS1, S2, and S3, the contact parts PA1, PA2, and PA3, and the switchingelements TrD1, TrD2, and TrD3 illustrated in FIG. 4 .

While the counter substrate SUB2 includes the color filters CFR, CFG,and CFB in three colors in FIG. 6 , it may include color filters in fouror more colors different from red, green, and blue such as white,transparent, yellow, magenta, and cyan. The color filters CFR, CFG, andCFB may be provided to the array substrate SUB1.

The array substrate SUB1 and the counter substrate SUB2 are disposedwith the first orientation film AL1 and the second orientation film AL2facing each other. The liquid crystal layer LC is sealed between thefirst orientation film AL1 and the second orientation film AL2. Theliquid crystal layer LC is made of a negative liquid crystal materialhaving negative dielectric anisotropy or a positive liquid crystalmaterial having positive dielectric anisotropy.

The array substrate SUB1 faces a backlight unit IL, and the countersubstrate SUB2 is positioned on the display surface side. The backlightunit IL may have various kinds of forms, and the detailed explanation ofthe configuration of the backlight unit IL is omitted.

A first optical element OD1 including a first polarizing plate PL1 isdisposed on the outer surface of the first insulating substrate 10 orthe surface facing the backlight unit IL. A second optical element OD2including a second polarizing plate PL2 is disposed on the outer surfaceof the second insulating substrate 20 or the surface on the observationposition side. A first polarization axis of the first polarizing platePL1 and a second polarization axis of the second polarizing plate PL2are in a cross-Nicol positional relation on the X-Y plane, for example.The first optical element OD1 and the second optical element OD2 mayinclude other optical functional elements, such as a phase-contrastplate.

Let us assume a case where the liquid crystal layer LC is made of anegative liquid crystal material, for example. When no voltage isapplied to the liquid crystal layer LC, liquid crystal molecules LM areinitially oriented with their long axes extending along the firstdirection X on the X-Y plane. By contrast, when a voltage is applied tothe liquid crystal layer LC, that is, in an on-state when an electricfield is formed between the pixel electrodes PE1 to PE3 and thedetection electrode CE, the orientation state of the liquid crystalmolecules LM changes because of the effects of the electric field. Inthe on-state, the polarization state of incident linearly polarizedlight changes depending on the orientation state of the liquid crystalmolecules LM when passing through the liquid crystal layer LC.

The following describes the configuration of the switching elementsTrD1, TrD2, and TrD3 illustrated in FIG. 7 in greater detail. Theswitching elements TrD1, TrD2, and TrD3 described below are top-gateelements. The switching elements TrD1, TrD2, and TrD3 may be bottom-gateelements. FIG. 7 illustrates only major parts required for theexplanation of the switching elements TrD1, TrD2, and TrD3 and does notillustrate the detection electrode CE, the pixel electrodes PE1 to PE3,the metal wires TL1 to TL3, or other components.

The switching elements TrD1, TrD2, and TrD3 are disposed side by side inthe first direction X. The switching element TrD1 includes asemiconductor layer SC1. The switching element TrD2 includes asemiconductor layer SC2. The switching element TrD3 includes asemiconductor layer SC3. The semiconductor layers SC1 to S3 each have asubstantially U-shape and intersect the scanning line G2 at twopositions.

In the switching element TrD1, the semiconductor layer SC1 has a firstpart E11 on a first end and a second part E12 on a second end. The firstpart E11 is electrically coupled to the signal line S1 via a contacthole CH11. The second part E12 is electrically coupled to the pixelelectrode PE1 (refer to FIG. 5 ) via a contact hole CH12.

The two parts of the scanning line G2 intersecting the semiconductorlayer SC1 serve as gate electrodes WG11 and WG12.

In the switching element TrD2, the semiconductor layer SC2 has a firstpart E21 on a first end and a second part E22 on a second end. The firstpart E21 is electrically coupled to the signal line S2 via a contacthole CH21. The second part E22 is electrically coupled to the pixelelectrode PE2 (refer to FIG. 5 ) via a contact hole CH22.

The two parts of the scanning line G2 intersecting the semiconductorlayer SC2 serve as gate electrodes WG21 and WG22.

In the switching element TrD3, the semiconductor layer SC3 has a firstportion E31 on a first end and a second portion E32 on a second end. Thefirst part E31 is electrically coupled to the signal line S3 via acontact hole CH31. The second part E32 is electrically coupled to thepixel electrode PE3 (refer to FIG. 5 ) via a contact hole CH32.

The two parts of the scanning line G2 intersecting the semiconductorlayer SC3 serve as gate electrodes WG31 and WG32. Of the threesemiconductor layers SC1, SC2, and SC3 arranged side by side in thedirection in which the scanning line G2 extends, the second part E32 ofthe semiconductor layer SC3 is on a straight line in which the secondpart E12 of the semiconductor layer SC1 and the second part E22 of thesemiconductor layer SC2 are arranged. In the following description, thesemiconductor layers SC1, SC2, and SC3 may be collectively referred toas SC.

Since the contact hole CH22 and the contact hole CH32 have the sameconfiguration as the contact hole CH12, the contact hole CH12 will bedescribed below, and the description of the contact hole CH22 and thecontact hole CH32 will be omitted. As illustrated in FIGS. 8 and 9 , thecontact part PA1 of the pixel electrode PE1 faces a contact electrode REand is electrically coupled to the contact electrode RE via the contacthole CH12. FIG. 9 illustrates the configuration below the firstorientation film AL1 illustrated in FIG. 6 .

In FIG. 9 , the first insulating film 11 has a silicon nitride base film111 and a silicon oxide insulating film 112 laminated on the base film111. The second insulating film 12 is a silicon oxide made of TEOS(tetraethoxysilane).

As illustrated in FIG. 8 , the contact hole CH12 includes a contact holeCH121, a contact hole CH122, a contact hole CH123, and a contact holeCH124. The contact hole CH121, the contact hole CH122, the contact holeCH123, and the contact hole CH124 illustrated in FIGS. 8 and 9 representthe size of the bottom surface in a plan view of the XY plane. Thecontact hole CH121, the contact hole CH122, the contact hole CH123, andthe contact hole CH124 can be referred as the first contact hole CH121,the second contact hole CH122, the third contact hole CH123, and thefourth contact hole CH124, respectively.

As illustrated in FIG. 9 , a light-shielding body LS is positionedbetween the first insulating substrate 10 and the first insulating film11. The semiconductor layer SC1 is positioned between the firstinsulating film 11 and the second insulating film 12. While thesemiconductor layer SC1 is made of polycrystalline silicon, for example,they may be made of amorphous silicon or an oxide semiconductor, forexample.

The contact electrode RE includes a first contact conductive layer RE1,a second contact conductive layer RE2, and a third contact conductivelayer RE3. The first contact conductive layer RE1 is coupled to thesecond part E12 of the switching element TrD1 illustrated in FIG. 7 .The first contact conductive layer RE1 serves as a drain (or source) ofthe switching element TrD1. The first contact conductive layer RE1 isformed simultaneously with the signal lines S1, S2, and S3 and made ofthe same material as that of the signal lines S1, S2, and S3.

The second contact conductive layer RE2 is formed simultaneously withthe metal wires TL1, TL2, and TL3 and made of the same material as thatof the metal wires TL1, TL2, and TL3. The second contact conductivelayer RE2 is electrically coupled to the above of the first contactconductive layer RE1.

The third contact conductive layer RE3 is formed simultaneously with thedetection electrode CE and made of the same material as that of thedetection electrode CE. The contact part PA1 of the pixel electrode PE1is electrically coupled to the second contact conductive layer RE2 viathe third contact conductive layer RE3.

As illustrated in FIG. 9 , the first insulating film 11 is provided onthe first insulating substrate 10. The first insulating film 11 coversthe light-shielding body LS on the first insulating substrate 10.

The semiconductor layer SC1 is provided on the first insulating film 11.The second insulating film 12 is provided on the semiconductor layerSC1. The gate electrode WG12 is provided on the second insulating film.The third insulating film 13 is provided on the gate electrode WG12 andcovers the gate electrode WG12 and the semiconductor layer SC1.

As illustrated in FIG. 6 , the signal line S1 is provided on the thirdinsulating film 13. As illustrated in FIG. 7 , the signal line S1 iscoupled to the first part E11 of the semiconductor layer SC1. The firstcontact conductive layer RE1 illustrated in FIG. 9 is provided on thethird insulating film 13. The first contact conductive layer RE1 iscoupled to the second part E12 of the semiconductor layer SC1 via thecontact hole CH121 formed in the third insulating film 13.

As illustrated in FIG. 6 , the fourth insulating film 14 is provided onthe signal line S1. As illustrated in FIG. 9 , the second contactconductive layer RE2 is provided on the fourth insulating film 14. Thesecond contact conductive layer RE2 comes into contact with the firstcontact conductive layer RE1 via the contact hole CH122 formed in thefourth insulating film 14. The area on the bottom surface of the contacthole CH122 illustrated in FIG. 8 is the contact area of the secondcontact conductive layer RE2 in which the first contact conductive layerRE1 and the second contact conductive layer RE2 are in contact with eachother.

As illustrated in FIG. 6 , the metal wire TL1 is provided on the fourthinsulating film 14. The fifth insulating film 15 covers the fourthinsulating film 14 and the metal wire TL1. As illustrated in FIG. 9 ,the fifth insulating film 15 covers a part of the second contactconductive layer RE2 in the contact region in contact with the firstcontact conductive layer RE1, and the rest of the second contactconductive layer RE2 is exposed at the contact hole CH123 or contacthole CH124. The rest of the second contact conductive layer RE2 iscovered with the third contact conductive layer RE3.

As illustrated in FIG. 9 , the third contact conductive layer RE3 isprovided over the fifth insulating film 15 and the second contactconductive layer RE2.

The detection electrode CE is provided on the fifth insulating film 15.The sixth insulating film 16 is provided on the detection electrode CEand the third contact conductive layer RE3.

The contact portion PA1 of the pixel electrode PE1 is in contact withthe third contact conductive layer RE3 via the contact hole CH124 formedin the sixth insulating film 16. As illustrated in FIG. 8 , the contacthole CH124 and the contact hole CH123 are located at overlappingpositions in a plan view of the XY plane. With this structure, thesecond contact conductive layer RE2 and the contact portion PA1 of thepixel electrode PE1 are electrically coupled.

Since the fifth insulating film 15 covers a part of the second contactconductive layer RE2 in the contact region in contact with the firstcontact conductive layer RE1 near the second direction Y, the contacthole CH123 deviates from the contact hole CH122 toward the seconddirection Y.

An angle ψ1 is an angle formed by the wall surface of the contact holeCH122 formed in the fourth insulating film 14 with a plane parallel tothe XY plane of the first insulating substrate 10. An angle ψ2 is anangle formed by the wall surface of the contact hole CH123 formed in thefifth insulating film with a plane parallel to the plane of the firstsubstrate.

The angle ψ2 is smaller than the angle ψ1. The angle ψ2 is less than 60degrees. For example, the angle ψ2 is 45 degrees or more and 55 degreesor less.

As illustrated in FIG. 8 , the contact electrode RE does not overlapwith the scanning line G1 in the plan view of the XY plane. With thisstructure, the parasitic capacitance between the contact electrode REand the scanning line G1 can be suppressed.

As illustrated in FIG. 4 , the detection electrode CE and the metalwires TL1, TL2, and TL3 are electrically coupled at any one of widenedparts TCE1, TCE2, and TCE3, which are parts of the metal wires TL1, TL2,and TL3, respectively. As illustrated in FIG. 5 , the widened partsTCE1, TCE2, and TCE3 are disposed at positions not aligning with thecontact parts PA1, PA2, and PA3 having the contact holes CH12, CH22, andCH32, respectively. With this structure, the sub-detection electrode CEAthat couples the main detection electrodes CEP disposed side by side inthe second direction Y is disposed at a position overlapping the metalwire TL2. This configuration can maintain the thickness of the fifthinsulating film 15 and reduce the width of the sub-pixel SPix in thefirst direction X. As a result, the display device PNL according to thefirst embodiment can have higher resolution.

As illustrated in FIG. 6 , the width of main lines ML (refer to FIG. 4 )of the metal wires TL1, TL2, and TL3 in the first direction X is smallerthan that of the light-shielding layer BM. This structure makes the mainlines ML of the metal wires TL1, TL2, and TL3 less likely to be visuallyrecognized.

As illustrated in FIG. 5 , the width of the widened parts TCE1, TCE2,and TCE3 is larger than that of the main lines ML of the metal wiresTL1, TL2, and TL3 in the first direction X. In FIG. 5 , thelight-shielding layer BM has a plurality of first parts BM1 extending inthe first direction X and a plurality of second parts BM2 extending inthe second direction Y. The light-shielding layer BM surrounds theopenings AP of the sub-pixels SPix in a planar view of the X-Y plane.With this structure, at least a part of the widened parts TCE1, TCE2,and TCE3 overlaps the second part BM2 and the other part thereofprotrudes from the second part BM2 in a planar view of the X-Y plane. Inother words, as illustrated in FIG. 5 , the width of the widened partsTCE1, TCE2, and TCE3 is larger than that of the second part BM2 of thelight shielding layer BM in the first direction X.

As illustrated in FIG. 13 , in the display device PNL according to thefirst embodiment, a pixel having the widened parts TCE1, TCE2, and TCE3serves as a pixel Pix (first pixel) including the coupling part CT(refer to FIGS. 10 to 12 ). By contrast, in the display device PNLaccording to the first embodiment, a pixel not having the widened partsTCE1, TCE2, and TCE3 serves as a pixel Pix (second pixel) not includingthe coupling part CT. The pixels Pix (first pixels) including thecoupling part CT (refer to FIGS. 10 to 12 ) and the pixels Pix (secondpixels) not including the coupling part CT are alternately disposed inthe first direction X. The pixels Pix including the coupling part CT andthe pixels Pix not including the coupling part CT are alternatelydisposed in the second direction Y. As described above, non-couplingregions PTN not having the widened parts TCE1, TCE2, and TCE3 arepresent in every other pixel Pix, thereby reducing the amount ofshielded light due to the effects of the widened parts TCE1, TCE2, andTCE3.

As illustrated in FIG. 13 , first coupling regions PT1, second couplingregions PT2, third coupling regions PT3, and the non-coupling regionsPTN are disposed in 6×6 pixels Pix. In the first coupling regions PT1,the second coupling regions PT2, and the third coupling regions PT3, thepixel Pix has any one of the widened parts TCE1, TCE2, and TCE3 in thesub-pixels SPix.

In the first coupling region PT1, the widened part TCE1 is electricallycoupled to the detection electrode CE in the contact hole TH. With thisstructure, as illustrated in FIG. 10 , the widened part TCE1 is coupledto the detection electrode CE as the coupling part CT. In the firstcoupling region PT1, the widened parts TCE2 and TCE3 are not coupled tothe detection electrode CE.

In the second coupling region PT2, the widened part TCE2 is electricallycoupled to the detection electrode CE in the contact hole TH. With thisstructure, as illustrated in FIG. 11 , the widened part TCE2 is coupledto the detection electrode CE as the coupling part CT. In the secondcoupling region PT2, the widened parts TCE1 and TCE3 are not coupled tothe detection electrode CE.

In the third coupling region PT3, the widened part TCE3 is electricallycoupled to the detection electrode CE in the contact hole TH. With thisstructure, as illustrated in FIG. 12 , the widened part TCE3 is coupledto the detection electrode CE as the coupling part CT. In the thirdcoupling region PT3, the widened parts TCE1 and TCE2 are not coupled tothe detection electrode CE.

As illustrated in FIG. 13 , the pixel Pix (first pixel) having thewidened parts TCE1, TCE2, and TCE3 includes the sub-pixels SPix1, SPix2,and SPix3. Similarly, the pixel Pix (second pixel) not having thewidened parts TCE1, TCE2, and TCE3 includes the sub-pixels SPix1, SPix2,and SPix3. Three pixels Pix (first pixels) having the widened partsTCE1, TCE2, and TCE3 are disposed side by side in the second direction Ywith the pixels Pix (second pixels) not having the widened parts TCE1,TCE2, and TCE3 sandwiched therebetween. In one of the three pixels Pix(first pixels) having the widened parts TCE1, TCE2, and TCE3, thewidened part TCE1 of the sub-pixel SPix1 is coupled to the detectionelectrode CE in the contact hole TH in the first coupling region PT1.

Similarly, in one of the three pixels Pix (first pixels) having thewidened parts TCE1, TCE2, and TCE3, the widened part TCE2 of thesub-pixel SPix2 is coupled to the detection electrode CE in the contacthole TH in the second coupling region PT2. With this structure, asillustrated in FIG. 11 , the widened part TCE2 is coupled to thedetection electrode CE as the coupling part CT. In one of the threepixels Pix (first pixels) having the widened parts TCE1, TCE2, and TCE3,the widened part TCE3 of the sub-pixel SPix3 is coupled to the detectionelectrode CE in the contact hole TH.

Three pixels Pix (first pixels) having the widened parts TCE1, TCE2, andTCE3 are disposed side by side in the first direction X with the pixelsPix (second pixels) not having the widened parts TCE1, TCE2, and TCE3sandwiched therebetween. In one of the three pixels Pix (first pixels)having the widened parts TCE1, TCE2, and TCE3, the widened part TCE1 ofthe sub-pixel SPix1 is coupled to the detection electrode CE in thecontact hole TH in the first coupling region PT1. Similarly, in one ofthe three pixels Pix (first pixels) having the widened parts TCE1, TCE2,and TCE3, the widened part TCE2 of the sub-pixel SPix2 is coupled to thedetection electrode CE in the contact hole TH in the second couplingregion PT2. In one of the three pixels Pix (first pixels) having thewidened parts TCE1, TCE2, and TCE3, the widened part TCE3 of thesub-pixel SPix3 is coupled to the detection electrode CE in the contacthole TH.

With this configuration, the positions of the contact holes TH areevenly dispersed. Thus, the distortion of the first orientation film AL1due to the effects of the contact holes TH becomes inconspicuous. As aresult, the display quality is less likely to deteriorate.

In each of the first coupling regions PT1, the second coupling regionsPT2, and the third coupling regions PT3, the sub-pixels SPix1, SPix2,and SPix3 have the widened parts TCE1, TCE2, and TCE3, respectively.With this configuration, the widened parts TCE1, TCE2, and TCE affectthe sub-pixels SPix1, SPix2, and SPix3, respectively, thereby reducingfluctuations in shielding light.

FIG. 10 is the sectional view of the X-X′ section in FIG. 13 . Asillustrated in FIG. 10 , the widened part TCE1 and the detectionelectrode CE are electrically coupled in the contact hole TH. At thecoupling part CT, the widened part TCE1 is directly in contact with thedetection electrode CE. Alternatively, at the coupling part CT, anotherconductive layer may be interposed between the widened part TCE1 and thedetection electrode CE. The widened part TCE2 and the detectionelectrode CE are not electrically coupled in the X-X′ section in FIG. 13. The widened part TCE3 and the detection electrode CE are notelectrically coupled in the X-X′ section in FIG. 13 .

FIG. 11 is the sectional view of the XI-XI′ section in FIG. 13 . Asillustrated in FIG. 11 , the widened part TCE2 and the detectionelectrode CE are electrically coupled in the contact hole TH. At thecoupling part CT, the widened part TCE2 is directly in contact with thedetection electrode CE. Alternatively, at the coupling part CT, anotherconductive layer may be interposed between the widened part TCE2 and thedetection electrode CE. The widened part TCE1 and the detectionelectrode CE are not electrically coupled in the XI-XI′ section in FIG.13 . The widened part TCE3 and the detection electrode CE are notelectrically coupled in the XI-XI′ section in FIG. 13 .

FIG. 12 is the sectional view of the XII-XII′ section in FIG. 13 . Asillustrated in FIG. 12 , the widened part TCE3 and the detectionelectrode CE are electrically coupled in the contact hole TH. At thecoupling part CT, the widened part TCE3 is directly in contact with thedetection electrode CE. Alternatively, at the coupling part CT, anotherconductive layer may be interposed between the widened part TCE3 and thedetection electrode CE. The widened part TCE1 and the detectionelectrode CE are not electrically coupled in the XII-XII′ section inFIG. 13 . The widened part TCE2 and the detection electrode CE are notelectrically coupled in the XII-XII′ section in FIG. 13 .

As illustrated in FIG. 13 , in each of the first coupling region PT1,the second coupling region PT2, and the third coupling region PT3, oneof the widened parts TCE1, TCE2, and TCE3 is coupled to the detectionelectrode CE, and the other two of them are not coupled to the detectionelectrode CE. One first coupling region PT1, one second coupling regionPT2, and one third coupling region PT3 are disposed in the firstdirection X in the 6×6 pixels Pix. One first coupling region PT1, onesecond coupling region PT2, and one third coupling region PT3 aredisposed in the second direction Y in the 6×6 pixels Pix.

FIG. 7 of Japanese Patent Application Laid-open Publication No.2017-146449 describes a sectional view illustrating a phenomenon inwhich an orientation film is not formed in a contact hole. Asillustrated in FIG. 7 of Japanese Patent Application Laid-openPublication No. 2017-146449, it is considered that when a liquidorientation film material is applied in a state where there are bubblesat the bottom of the contact hole, the bubbles divide the orientationfilm material. The orientation film material in the contact hole mayoverlap the orientation film material around the contact hole, causingfilm thickness unevenness of the orientation film material. If the filmthickness unevenness of the orientation film material exceeds the rangethat can be shielded by the light-shielding layer BM and is affected,the display unevenness of the display device PNL may occur.

Therefore, the display device PNL according to the first embodimentincludes the array substrate SUB1, the counter substrate SUB2 providedwith the color filters, and the liquid crystal layer LC between thearray substrate SUB1 and the counter substrate SUB2. On one surface ofthe array substrate SUB1, the scanning lines GL arranged side by side inthe second direction Y with a gap interposed therebetween, the signallines SL arranged side by side in the first direction X with a gapinterposed therebetween, the fourth insulating film 14 serving as thefirst organic insulating film and provided on the signal lines SL, andthe fifth insulating film 15 serving as the second organic insulatingfilm and provided on the fourth insulating film 14 are provided. In eachregion surrounded by the corresponding scanning lines GL and thecorresponding signal line SL, the semiconductor layer SC, the firstcontact conductive layer RE1, the second contact conductive layer RE2,and the pixel electrode PE as the first electrode are provided. Thesignal line SL is electrically coupled to the first part of thesemiconductor layer SC, and the first contact conductive layer RE1 iselectrically coupled to the second part of the semiconductor layer SC.The second contact conductive layer RE2 comes into contact with thefirst contact conductive layer RE1 via the second contact hole CH122formed in the fourth insulating film 14. At least a part of the contactregion of the second contact conductive layer RE2 in which the secondcontact conductive layer RE2 is in contact with the first contactconductive layer RE1 is covered with the fifth insulating film 15. Thepixel electrode PE and the second contact conductive layer RE2 areelectrically coupled to each other via the third contact hole CH123formed in the fifth insulating film 15. The second contact hole CH122and the third contact hole CH123 deviate from each other in the seconddirection Y.

This structure reduces the space volume of the third contact hole CH123formed in the fifth insulating film 15. Even if the orientation filmmaterial to be the first orientation film AL1 is applied to the bottomof the third contact hole CH123 and bubbles are generated, the amount ofthe orientation film material discharged to the outer periphery of thecontact hole CH123 due to the bubbles is small. Thus, the film thicknessunevenness of the first orientation film AL1 becomes small around thecontact hole CH123. Therefore, since the film thickness unevenness ofthe orientation film material exceeds the range that can be shielded bythe light-shielding layer BM but is less likely affected, the displayunevenness of the display device PNL may be suppressed.

The angle ψ2 is smaller than the angle ψ1. With this structure, thecontact angle with the orientation film material to be the firstorientation film AL1 becomes small, so that the orientation filmmaterial can be easily filled in the contact hole CH123. Bubbles areless likely to be generated. As a result, the display unevenness of thedisplay device PNL is suppressed.

The display device PNL according to the first embodiment includes thedetection electrode CE as the second electrode provided on the fifthinsulating film 15 and the sixth insulating film 16 serving an inorganicinsulating film provided on the detection electrode CE and the metalwire TL. The pixel electrode PE is provided on the sixth insulating film16. The metal wire TL is electrically coupled to the detection electrodeCE via the contact hole TH and is provided on the fourth insulating film14. The metal wire TL is covered with the fifth insulating film 15. Asillustrated in FIG. 2 , the metal wire TL is superimposed on both theelectrically coupled detection electrode CE and the electricallyuncoupled detection electrode CE in a plan view of the XY plane. Thefifth insulating film 15 is an organic insulating film, and thus can beformed thick. Therefore, as illustrated in FIG. 2 , the signaltransmitted through the metal wire TL is unlikely to affect theuncoupled detection electrode CE.

The metal wire TL overlaps with the signal line SL. The fourthinsulating film 14 is an organic insulating film, and thus can be formedthick. Therefore, as illustrated in FIG. 6 , the signal transmittedthrough the metal wire TL does not easily affect the signal line SL. Thesignal transmitted through the signal line SL does not easily affect themetal wire TL.

Because the metal wire TL overlaps the signal line SL, the width of themetal wire TL in the first direction X is larger than that of the signalline SL. This structure facilitates alignment in deposition and canreduce the resistance of the metal wire TL. The width of the main lineML of the metal wire TL in the first direction X is preferably smallerthan that of the light-shielding layer BM overlapping the metal wire TL.This structure makes the metal wire TL less likely to be visuallyrecognized.

The metal wire TL has, at a part thereof, any one of the widened partsTCE1 to TCE3 having the width in the first direction X larger than thatof the main line. With the widened parts TCE1, TCE2, and TCE3 having asufficiently large width, a contact area between any one of the widenedparts TCE1, TCE2, and TCE3 and the detection electrode CE can be securedby forming the contact hole TH even if the thickness of the fifthinsulating film 15 increases. As described above, the fifth insulatingfilm 15 has the contact holes TH. The contact holes TH each have thecoupling part CT at which the detection electrode CE and any one of thewidened parts TCE1, TCE2, and TCE3 are coupled. This configuration cansecure the distance between the metal wires TL1, TL2, and TL3 and thedetection electrode CE in the third direction Z, thereby reducingparasitic capacitance generated between the detection electrode CE andthe metal wires TL1, TL2, and TL3 passing over the detection electrodeCE. With the widened part TCE1 having a sufficiently large width, thefifth insulating film 15 can be made of a resin material hard to depositwith a smaller width.

The detection electrode CE is disposed on the upper side than the metalwire TL with the fifth insulating film 15 interposed therebetween in thethird direction Z. The fifth insulating film 15 has the contact holes THin which the detection electrode CE and any one of the widened partsTCE1, TCE2, and TCE3 are coupled. The widened parts TCE1, TCE2, and TCE3are disposed above and overlap the signal lines SL. With thisconfiguration, distortion of the first orientation film AL1 due to theeffects of the contact holes TH is less likely to affect the pixelelectrodes PE1, PE2, and PE3. As a result, the display quality is lesslikely to deteriorate.

As illustrated in FIG. 14 , the contact holes TH are formed between onedetection electrode CE and one metal wire TL1, for example. Thisconfiguration can reduce coupling resistance, thereby suppressingwaveform deterioration in the drive signals supplied to the detectionelectrode CE. As a result, the display device PNL can detect thecapacitance with higher accuracy.

As illustrated in FIG. 5 , the widened parts TCE1, TCE2, and TCE3 aredisposed between two scanning lines G1 and G2 disposed side by side. Ina planar view of the X-Y plane, none of the widened parts TCE1, TCE2,and TCE3 overlaps the first part BM1. With this configuration, thepositions of the widened parts TCE1, TCE2, and TCE3 are different fromthose of the contact parts PA1, PA2, and PA3 of the pixel electrodesPE1, PE2, and PE3, respectively, illustrated in FIG. 5 . As a result, asillustrated in FIG. 14 , the contact holes TH can be formed moreprecisely, thereby increasing the reliability of electrically couplingbetween the detection electrode CE and the metal wire TL.

Second Embodiment

FIG. 14 is a plan view for explaining contact holes according to thesecond embodiment. FIG. 15 is a partial sectional view for explainingthe XV-XV′ section in FIG. 14 . FIG. 17 is a schematic diagram forexplaining the sub-pixels according to the second embodiment. Componentsdescribed in the first embodiment are denoted by like referencenumerals, and the explanation thereof is omitted. As illustrated inFIGS. 14 and 15 , the second embodiment is different from the firstembodiment in the configuration of the contact hole CH123 and thecontact hole CH124.

As illustrated in FIG. 15 , the contact hole CH123 and the contact holeCH124 cover the entire second contact conductive layer RE2 in thecontact region in contact with the first contact conductive layer. Thesecond contact conductive layer RE2 on the fourth insulating film 14 isexposed in the contact hole CH123 or the contact hole CH124.

The contact hole CH123 formed in the fifth insulating film 15 exposesthe second contact conductive layer RE2 the bottom of which is above thefourth insulating film 14. The third contact conductive layer RE3 isprovided over the fifth insulating film 15 and the second contactconductive layer RE2.

The detection electrode CE is provided on the fifth insulating film 15.The sixth insulating film 16 is provided on the detection electrode CEand the third contact conductive layer RE3.

The contact portion PA1 of the pixel electrode PE1 is in contact withthe third contact conductive layer RE3 via the contact hole CH124 formedin the sixth insulating film 16.

The contact hole CH124 and the contact hole CH123 are located atoverlapping positions in the plan view of the XY plane. With thisstructure, the second contact conductive layer RE2 and the contactportion PA1 of the pixel electrode PE1 are electrically coupled.

Since the fifth insulating film 15 covers the entire second contactconductive layer RE2 in the contact region in contact with the firstcontact conductive layer RE1, the contact hole CH123 deviates from thecontact hole CH122 toward the second direction Y.

The angle ψ2 is smaller than the angle ψ1. The angle ψ2 is less than 60degrees. For example, the angle ψ2 is 45 degrees or more and 55 degreesor less.

As described above, the entire second contact conductive layer RE2 inthe contact region in contact with the first contact conductive layer iscovered with the fifth insulating film 15. The second contact hole CH122and the third contact hole CH123 do not overlap in the plan view of theXY plane. This structure reduces the space volume of the third contacthole CH123 formed in the fifth insulating film 15. Even if theorientation film material to be the first orientation film AL1 isapplied to the bottom of the third contact hole CH123 and bubbles aregenerated, the amount of the orientation film material discharged to theouter periphery of the contact hole CH123 due to the bubbles is small.Thus, the film thickness unevenness of the first orientation film AL1becomes small around the contact hole CH123. Therefore, since the filmthickness unevenness of the orientation film material exceeds the rangethat can be shielded by the light-shielding layer BM but is less likelyaffected, the display unevenness of the display device PNL may besuppressed.

Third Embodiment

FIG. 16 is a plan view for explaining the switching elements accordingto a third embodiment. FIG. 17 is a schematic diagram for explaining thesub-pixels according to the third embodiment. Components described inthe first embodiment are denoted by like reference numerals, and theexplanation thereof is omitted. The third embodiment is different fromthe first embodiment in the configuration of a sub-pixel SPix13.

In the switching element TrD3 according to the third embodiment, thesemiconductor layer SC3 has the first part E31 on the first end and thesecond part E32 on the second end. The first part E31 is electricallycoupled to the signal line S3 via a contact hole CH31. The second endE32 is electrically coupled to the contact electrode RE via the contacthole CH32. The contact electrode RE is positioned between the signalline S2 and the signal line S3. The contact electrode RE of theswitching element TrD3, the first part E31, and the second part E32 arepositioned on the side closer to the scanning line G3 with respect tothe scanning line G2.

The two parts of the scanning line G2 intersecting the semiconductorlayer SC3 serve as the gate electrodes WG31 and WG32. Thelight-shielding body LS is positioned under the part of thesemiconductor layer SC3 intersecting the gate electrode WG32. The secondpart E32 is shifted to the opposite side of the scanning line G2 withrespect to the position where the second part E12 and the second partE33 are disposed side by side.

The two parts of the scanning line G2 intersecting the semiconductorlayer SC3 serve as gate electrodes WG31 and WG32. Of the threesemiconductor layers SC1, SC2, and SC3 arranged side by side in thedirection in which the scanning line G2 extends, the second part E32 ofthe semiconductor layer SC3 is at a position deviated from the straightline in which the second part E12 of the semiconductor layer SC1 and thesecond part E22 of the semiconductor layer SC2 are arranged. With thisstructure, the area of the sub-pixel SPix13 can be increased.

The contact holes CH12 and CH22 are formed side by side on a single lineextending along the first direction X. By contrast, the contact holeCH32 is positioned in an oblique direction intersecting the firstdirection X with respect to the contact holes CH12 and CH22. In otherwords, the contact hole CH32 is formed at a position deviated from thesingle line on which the contact holes CH12 and CH22 are formed side byside.

The widened parts TCE1, TCE2, and TCE3 are disposed above and overlapany one of the contact holes CH11, CH21, and CH31 illustrated in FIG. 16. As a result, the contact holes TH can be formed more precisely,thereby increasing the reliability of electrical coupling between thedetection electrode CE and the metal wire TL.

As illustrated in FIG. 17 , the sub-pixels SPix1 are arrayed along thesecond direction Y in the first column. The sub-pixels SPix2 are arrayedalong the second direction Y in the second column next to the firstcolumn. The sub-pixel SPix3 and the sub-pixel SPix13 are alternatelyarrayed along the second direction Y in the third column next to thesecond column. The first column, the second column, and the third columnare cyclically arrayed in the first direction X. The sub-pixels SPix1are provided with the color filter of red (R). The sub-pixels SPix2 areprovided with the color filter of green (G). The sub-pixels SPix3 areprovided with the color filter of white or transparent (W). Thesub-pixels SPix13 are provided with the color filter of blue (B).

Because the sub-pixels SPix13 increase the luminance, the current valueof the backlight unit IL can be reduced, thereby reducing powerconsumption. This configuration can secure the area of blue (B) havinglower visibility.

While exemplary embodiments have been described, the embodiments are notintended to limit the present disclosure. The contents disclosed in theembodiments are given by way of example only, and various modificationsmay be made without departing from the spirit of the present disclosure.Appropriate modifications made without departing from the spirit of thepresent disclosure naturally fall within the technical scope of thedisclosure.

The widened parts TCE1, TCE2, and TCE3, for example, may be referred toas any one of relay electrodes, coupling parts, wide parts, expandedparts, widened parts, and base parts or simply referred to as firstparts of the metal wire TL, for example. The coupling part CT may bereferred to as a contact part.

The metal wire TL may be an auxiliary wire that does not supply thedrive signal to the detection electrode CE, and the detection electrodeCE may be a solid film electrode.

While the plane defined by the first direction X and the seconddirection Y is parallel to the surface of the array substrate SUB1, thesurface of the array substrate SUB1 may be curved. In this case, viewedin a direction in which the display device PNL has the largest area, acertain direction is a first direction, and a direction intersecting thefirst direction is a second direction. The direction in which thedisplay device PNL has the largest area is defined as a third directionorthogonal to the first direction and the second direction.

What is claimed is:
 1. A display device comprising: a scanning line; asemiconductor layer; a pixel electrode; a first insulating film having afirst contact hole; an organic insulating film having a second contacthole; a second insulating film having a third contact hole; and a thirdinsulating film provided between the pixel electrode and the secondinsulating film, wherein the semiconductor layer has a first linearportion that is orthogonal to the scanning line, the pixel electrode iselectrically connected to the first linear portion via the first contacthole, the second contact hole, and the third contact hole, the firstlinear portion overlaps the first contact hole, the second contact hole,and the third contact hole that are aligned along the first linearportion, a center of the second contact hole is located between a centerof the first contact hole and a center of the third contact hole, theorganic insulating film is provided between the first insulating filmand the second insulating film, the second insulating film is providedbetween the pixel electrode and the organic insulating film, the firstcontact hole exposes the first linear portion, the third insulating filmhas a fourth contact hole, the pixel electrode is electrically connectedto the first linear portion via the first contact hole, the secondcontact hole, the third contact hole, and the fourth contact holes, acenter of the fourth contact hole is shifted from the center of thethird contact hole relative to an extending direction of the firstlinear portion, and the fourth contact hole has an overlapping portionthat overlaps the third contact hole and a portion that does not overlapthe third contact hole.
 2. The display device of claim 1, wherein, in aplan view, a size of the second contact hole is larger than a size ofthe first contact hole, and a size of the third contact hole is largerthan the size of the second contact hole.
 3. The display device of claim1, wherein the second contact hole has an overlapping portion thatoverlaps the third contact hole and a portion that does not overlap thethird contact hole, and the third contact hole has the overlappingportion that overlaps the second contact hole and a portion that doesnot overlap the second contact hole.
 4. The display device of claim 1,wherein the pixel electrode has a contact part and a pair of electrodeparts, the first contact hole is located between the pair of theelectrode parts, outside the contact part.
 5. The display device ofclaim 1, further comprising an insulating substrate and light-shieldingbody, wherein the light-shielding body is provided between the scanningline and the insulating substrate, the light-shielding body is locatedoverlapping a region where the first linear portion and the scanningline cross at right angles, and part of the third contact hole overlapsthe light-shielding body, and the second contact hole does not overlapthe light-shielding body.
 6. The display device of claim 1, wherein partof the second contact hole overlaps the overlapping portion that thethird contact hole and the fourth contact hole overlap.
 7. The displaydevice of claim 1, further comprises a detection electrode, wherein thedetection electrode is opposed to the pixel electrode, the detectionelectrode is provided between the pixel electrode and the secondinsulating film, the detection electrode overlaps none of the firstcontact hole, the second contact hole, and the third contact hole, andthe third contact hole is located closer to the scanning line than thefirst contact hole is.
 8. The display device of claim 1, furthercomprises a common electrode, wherein the detection electrode is opposedto the pixel electrode, the detection electrode is provided between thepixel electrode and the third insulating film, the detection electrodeoverlaps none of the first contact hole, the second contact hole, thethird contact hole, and the fourth contact hole.